AMD Rolls Out New Dual-Core Processors for Embedded Device Market

 Sunnyvale, California-based Advanced Micro Devices has just announced the expansion of its processor portfolio with the introduction of two new, dual-core chips designed for the ASB1 BGA embedded client platform. Featuring a low TDP of just 18W, the new Turion Neo X2 model L625 and Athlon Neo X2 model L325 have been designed to provide PC-like performance in a smaller, lower-power package, like the embedded-friendly ball grid array (BGA) package.

“We are committed to helping simplify the development cycle for our embedded customers with a platform that readily addresses the shifting needs of their markets,” said Buddy Broeker, director, Embedded Computing Solutions Division, AMD. “Systems such as digital signage, point of sale, and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices.”

The ASB1 BGA embedded client platform has been designed for single board computing and thin client systems, as well as for self-service kiosks, point of sale machines and digital signage. The newly introduced processors from AMD have been featured with a TDP of 18W and are rated at clock speeds of 1.6GHz for the Turion Neo X2 L625 and 1.5GHz for the Athlon Neo X2 L325. In addition, these two models are designed to be compatible the chip maker’s 780E and M690E chipsets, providing for a complete x86-based solution.

“The rapid adoption of x86 processors in embedded designs, which is a trend that AMD helped spur in the high-end space, has largely been driven by the need to simplify designs and get them on the market more quickly,” said Eric Heikkila, director, Embedded Hardware and Systems analyst, VDC Research Group. “From the hardware perspective, AMD’s comprehensive platform approach offers mainstream performance, very low power consumption, and takes a lot of the guesswork out of the development process.”

According to the chip maker, its embedded products are offered with industry-standard 5-year component longevity.

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